With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...

The entire stress-strain curve can now be determined using nanoindentation with a flat-ended cylindrical punch and novel analysis of the resulting force-displacement data 1. Unlike pyramidal indenters ...

The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

Mechanical parts are more frequently subjected to cyclic loads than solely static loads. Fatigue issues are commonly observed in turbine blades, aerospace components, locomotive systems, large ...