A team of researchers has succeeded in developing a novel optical connection between semiconductor chips. "Photonic wire bonding" reaches data transmission rates in the range of several terabits per ...

A new technical paper titled “A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package” was published by ...

A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, performance and efficiency. Two-dimensional (2D) semiconductors, single-layer and ...

Wire bonding is widely used for first-level interconnection of semiconductor die to component leads or pads. It is vital that the interconnection corresponds to the product-specific bonding diagram ...

As the shift to electric vehicles (EVs) accelerates around the world, one Japanese company is attracting attention as a major supplier of components used in batteries and other indispensable ...

AuRoFUSE ™ is a composition of submicron-sized gold particles and a solvent that creates a bonding material with low electrical resistance and high thermal conductivity to achieve metal bonding at low ...