Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...

In the semiconductor industry, the outsourced semiconductor assembly and test (OSAT) sector plays a pivotal role in the global technology landscape. As the backbone of electronic device manufacturing, ...

In recent years, various die attach (DA) materials have been developed to cope with the higher power dissipation requirements of semiconductor devices. DA materials based on metals such as solder or ...

Indium Corporation ® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of ...

BERG, Switzerland–Alphasem AG on Tuesday (April 20) announced plans to acquire Sister Semiconductor Equipment GmbH (SSE), a supplier of chip-equipment based in Singen, Germany. With the acquisition, ...