"Driven by AI accelerators, automotive ECUs, and edge computing, the global semiconductor silicon wafer market sees rising ...

During lapping, a spinning abrasive surface is used to thin wafers from the backside. As the process progresses, precise feedback is required to monitor the amount of material removed and determine ...

As semiconductor manufacturing prioritizes flexibility, innovation, and cost control, manual wafer aligners are expected to ...

Semiconductor wafer defect pattern recognition and classification is a crucial area of research that underpins yield enhancement and quality assurance in microelectronics manufacturing. The discipline ...