Samsung, SK hynix, and Micron are fighting each other over new 16-Hi HBM memory, as NVIDIA requests the new 16-Hi HBM memory ...

SK Hynix will unveil a lineup of next-generation high-bandwidth memory (HBM) products at CES2026. The global No. 1 HBM ...

The company showcases 16-layer HBM4 product with 48GB, next generation HBM product, for the first time during the exhibition. The product is the next generation product of 12-layer HBM4 product with ...

Nvidia has reportedly begun testing the limits of the global AI memory supply chain by signaling interest in 16-layer ...

TL;DR: SK hynix is reportedly planning to introduce femto-second grooving and full-cut processes to its HBM4 and 400-layer and higher NAND flash, a move required as semiconductors get thinner and ...

Seeking Alpha is proud to welcome Vega North as a new contributing analyst. You can become one too! Share your best ...

An ultrathin ferroelectric capacitor, designed by researchers from Japan, demonstrates strong electric polarization despite ...

Developed core technology that will allow practical implementation of high-density, low-power 3D DRAM, presented at IEEE International Electron Devices Meeting (IEDM) ...

Samsung Electronics plans to open its new semiconductor research and development campus in mid-November. The installation of advanced equipment is set to take place from November 2024 onwards, aimed ...

LRCX's market position in the semiconductor supply chain is like selling shovels in a gold rush. The company's sales are closely tied to the growing global semiconductor capex. The current market ...