Transition-metal dichalcogenides (TMDs) are a class of material that’s been receiving significant attention as a possible successor of silicon. Recently, a team of researchers has demonstrated the use ...

SK Hynix will unveil a lineup of next-generation high-bandwidth memory (HBM) products at CES2026. The global No. 1 HBM ...

For semiconductor designers this outlines how a thin ferroelectric stack can retain polarization and support memory ...

Developed core technology that will allow practical implementation of high-density, low-power 3D DRAM, presented at IEEE International Electron Devices Meeting (IEDM) ...

Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable oxide-semiconductor channel transistors that will enable the practical implementation of ...

The company showcases 16-layer HBM4 product with 48GB, next generation HBM product, for the first time during the exhibition. The product is the next generation product of 12-layer HBM4 product with ...

Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...

Nvidia has reportedly begun testing the limits of the global AI memory supply chain by signaling interest in 16-layer ...

Modern computers struggle to match the efficiency of the human brain. Even recognizing handwritten digits can consume significant energy, largely ...

Samsung, SK hynix, and Micron are fighting each other over new 16-Hi HBM memory, as NVIDIA requests the new 16-Hi HBM memory ...