Tokyo, Japan, December 9, 2025-- FUJIFILM Corporation announced the launch of “ZEMATES™*1,” a new brand of photosensitive insulating materials for semiconductor back-end processes, centered on ...
TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass ...
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