Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...

Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable oxide-semiconductor channel transistors that will enable the practical implementation of ...

This year’s top semiconductor stories were mostly about the long and twisting trips a technology takes from idea (or even raw ...

The Semiconductor Device Research Laboratory (SDRL) is working on manufacturing semiconductors in space and using memory technology based on the mechanisms of the brain. The SDRL is researching how to ...

Developed core technology that will allow practical implementation of high-density, low-power 3D DRAM, presented at IEEE International Electron Devices Meeting (IEDM) ...

Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap layer separation are the keys to unlocking it. Inside the charge trap cell ...

Oversubscribed financing round consisting of €77 million in Series C equity capital, led by HV Capital and DTCF, and €23 million in public funding, marking one of the largest capital rounds in the ...

Two semiconductor experts at Samsung Electronics have been recognized as high-ranking members of the Institute of Electrical and Electronics Engineers (IEEE), a global technology standards and ...

The human brain does more than simply regulate synapses that exchange signals; individual neurons also process information through intrinsic plasticity, the adaptive ability to become more sensitive ...