System-in-package (SiP) technology is at the beginning of its revolution. Some see the SiP in the same way as a system on chip (SoC)—as an IC component with no simple path to further customization.
The impatient and hungry mobile electronics market is fueling the need for system packaging technologies as an interim solution before the inevitable transition to system-on-chip methodologies. While ...
Choosing between system-on-chip and system-in-package–SoC vs. SiP–means weighing factors such as integration level, package size, performance and time-to-market. Two applications where SiP was used to ...
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