Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX) Kicking off this ...

At the same time, the semiconductor industry has been moving toward 200 mm (8-inch) wafers to improve manufacturing ...

Specialty devices are the unsung heroes of modern life. For many in the semiconductor industry today, the spotlight is on the SiC and GaN power devices used in automotive, green energy, fast-charge ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

From quartz sand to silicon wafers, the manufacturing process is critical for achieving the purity and quality needed for advanced semiconductor applications.

Hybrid bonding has been in production for several years, with mature flows capable of delivering robust yields using 10µm interconnects. At that scale, processes can tolerate hundreds of nanometers of ...

“We've collaborated with EV Group for several years in developing thin-wafer handling processes for power devices due to their extensive expertise in temporary bonding and debonding,” stated Dr.

“Our 200-mm EVG850LT system has been instrumental in helping us fulfill customer requirements for high-performance SOI wafers,” stated Prof. He ZhiQiang, CEO of SST. “As we look to advance our ability ...

New Monolithic Lens Molding (MLM) capability enables up to eight-megapixel-and-higher-resolution devices. CHIBA, Japan, Dec. 1, 2010 /PRNewswire/ -- SEMICON JAPAN -- EV Group (EVG), a leading supplier ...

New advanced interconnect PDKs pave the way for high density, energy efficient chip to chip integration.