AI data centers and electrification are transforming the traditional power grid into a decentralized, multidirectional ecosystem.
The new 20A module integrates IGBTs, drivers and protection in an 18.8mm × 32.8mm DBC package for compact inverter designs.
The new devices combine low RDS(ON), high drain current and wettable flanks for compact, high-density automotive power designs.
YMIN supercapacitors gain UL 810A component recognition, helping simplify compliance, reduce project risks, and support North American applications.
Vertical Semiconductor's CEO discusses scaling FinFET vertical GaN on engineered substrates for AI data center power ...
The system combines 12 A/µs current dynamics, 95% energy recovery and scalable power to 1,920 kW for advanced power-system ...
The new IC consumes less than 0.75mW at 230VAC and supports AC-DC designs with X-capacitance from 100nF to 6μF.
The new rectifiers improve thermal performance and surge capability while supporting automated optical inspection in compact ...
Power electronics enables the hydrogen economy, converting AC to high-current DC for electrolyzers and reverse for fuel cells ...
The sensor combines 2µs output refresh, speeds above 50,000 rpm and three-axis magnetic sensing in a compact DFN-6 package.
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