The system combines 12 A/µs current dynamics, 95% energy recovery and scalable power to 1,920 kW for advanced power-system ...

AI data centers and electrification are transforming the traditional power grid into a decentralized, multi-directional ecosystem. Although traditional data centers have been around for decades, it is ...

Vertical Semiconductor's CEO discusses scaling FinFET vertical GaN on engineered substrates for AI data center power ...

The new 20A module integrates IGBTs, drivers and protection in an 18.8mm × 32.8mm DBC package for compact inverter designs.

The new devices combine low RDS(ON), high drain current and wettable flanks for compact, high-density automotive power designs.

The sensor combines 2µs output refresh, speeds above 50,000 rpm and three-axis magnetic sensing in a compact DFN-6 package.

YMIN supercapacitors gain UL 810A component recognition, helping simplify compliance, reduce project risks, and support North American applications.

The new IC consumes less than 0.75mW at 230VAC and supports AC-DC designs with X-capacitance from 100nF to 6μF.

TI's TMCS2100-Q1 uses multiaxial sensing to reject crosstalk in coreless Hall-effect current sensors for traction inverters.

The new SY757xx family combines voltage translation, low additive jitter and compact packaging for high-speed FPGA and SoC ...

GaN HEMTs with gate-termination extensions show improved single-event hardness, enabling higher operating voltages in LEO ...