This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation ...

AI data centers are driving a semiconductor revolution AI adoption is tripling data center demand by 2030. Henkel surveyed 120 semiconductor leade ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. If you have any questions on your Thermal Warpage and ...

According to data from our SiC Patent Monitor, power silicon carbide (SiC) technology saw robust patenting activity in Q1 2025, with over 840 new patent families filed globally. ... Semiconductor ...

As the technology leader in bond testing, xyztec continues to lead the way in innovation, redefining precision, speed, and efficiency in the semiconductor packaging industry. With the rapid ...

Press Release April 29, 2025 - Click the title to read the full press release. Toughened, UV Curable Adhesive Features Optical Clarity Master Bond UV15-7HP is a low viscosity, easy to apply, one-part, ...

Deca Technologies announced the signing of an agreement with IBM to implement Deca's M-Series™ and Adaptive Patterning® technologies in IBM's advanced packaging ...

Press Release May 20, 2025 - Click the title to read the full press release. NY CREATES and Fraunhofer IPMS Announce Joint Agreement to Advance Memory Devices at the 300mm Wafer Scale NY CREATES and ...

Press Release March 28, 2025 - Click the title to read the full press release. Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels Toray Engineering Co., Ltd., has ...

Agileo Automation announced the future expansion of its A²ECF-SEMI automation framework to include SEMI's EDA (Equipment Data Acquisition) standards suite. This ... Agileo Automation ...

Promex Industries, Inc. announced that CEO Richard (Dick) Otte has received the 2025 Electronics Manufacturing Technology Award from the IEEE Electronics Packaging ...

Semiconductor Packaging News - Exclusive: Univ. of Michigan Research Study Demonstrates Novel Synthesis Using Veeco's Fiji ALD System ...