CEA-Leti and Soitec announced a strategic partnership to enhance the cybersecurity of integrated circuits (ICs) through the innovative use of fully depleted silicon-on-insulator ... Semiconductor ...

EV Group (EVG) announced that it has once again topped the rankings in the 2025 TechInsights Semiconductor Supplier Awards. EVG was voted by customers as one of the Top 10 ... EV Group (EVG) ...

Polymer film fabrication is an essential process in various industries, from food packaging to battery production. The demand for precise, high-quality films is on the rise ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. If you have any questions on your Thermal Warpage and ...

According to data from our SiC Patent Monitor, power silicon carbide (SiC) technology saw robust patenting activity in Q1 2025, with over 840 new patent families filed globally. ... Semiconductor ...

Press Release November 22, 2023 - Click the title to read the full press release. KoolMicro Inc. developed First 2,000 W/cm2 Cooling Technology for High Heat Generation Chips KoolMicro Inc. has ...

As the technology leader in bond testing, xyztec continues to lead the way in innovation, redefining precision, speed, and efficiency in the semiconductor packaging industry. With the rapid ...

High-performance solar modules from Meyer Burger Technology AG have been officially recognized as eligible for subsidies under Italy's "Transizione 5.0" program. Full-service ... This technology works ...

Press Release April 29, 2025 - Click the title to read the full press release. Toughened, UV Curable Adhesive Features Optical Clarity Master Bond UV15-7HP is a low viscosity, easy to apply, one-part, ...

Smoltek Nanotech Holding AB announces a major technological milestone in CNF-MIM capacitor development, having successfully engineered an advanced dielectric stack ... Smoltek Nanotech Holding AB ...

Deca Technologies announced the signing of an agreement with IBM to implement Deca's M-Series™ and Adaptive Patterning® technologies in IBM's advanced packaging ...

Agileo Automation announced the future expansion of its A²ECF-SEMI automation framework to include SEMI's EDA (Equipment Data Acquisition) standards suite. This ... Agileo Automation ...