Semiconductor Engineering

Moore’s Law AI: Applying Agentic AI Across Chip Design

Moores Lab AI is betting that chip design AI will only work if it is built around deep semiconductor expertise, not generic ...
Semiconductor Engineering

TSMC OIP: Chip Industry Growth Blows Past Forecast

Aggressive prediction of $1T by 2030 was $700B too low. Here’s why.
Semiconductor Engineering

Impact of Cu Microstructure On The TSV-Induced Residual Stress Within Silicon (Purdue, UCLA)

Researchers at Purdue University and the UCLA published a technical paper titled “Experimental Evidence for the Impact of ...
Semiconductor Engineering

One Substrate No Longer Rules Them All

Larger packages, finer routing, and embedded functions are pushing advanced substrates toward application-specific designs.
Semiconductor Engineering

Managing 3D-IC Design And IP

Design data management, traceability, and revision control are critical for multi-chiplet heterogeneous integration.
Semiconductor Engineering

When AI Agents Cross Chip Design Silos

Chip design is moving toward specialized AI agents working together. Orchestration, integration, and guardrails are becoming critical. Human engineers still play a central role in guiding and ...
Semiconductor Engineering

EDA’s Future Is Evidence-Driven Automation

AI may accelerate semiconductor design, but users still need formal proof, semantic continuity, and auditable workflows to trust automation.
Semiconductor Engineering

3D Chips Push EDA Into New Territory

EDA tools are helping design 3D-ICs and multi-die systems by co-optimizing across domains and speeding up design exploration. Customers face several pain points, including vendor interoperability, ...