Teradyne has introduced Iris 100, a production-ready optical test platform for microLED devices that measures spectral ...

Molex has introduced VersaBeam Mini, a 16-fiber Expanded Beam Optical (EBO) connector with a 3.5 × 9 mm Very Small Form ...

Considered too expensive to deploy at scale in mobile networks, mmWave technologies are appearing in other use cases. When ...

Rambus is shipping a CryptoManager Root of Trust built to work with the open-source Caliptra specification, aimed at data ...

Ironwood Electronics has introduced a 70-GHz elastomer socket designed for 37.5 × 37.5-mm BGA packages with a 0.65-mm pitch.

TDK Corporation has expanded its CN series of low-resistance soft-termination SMD MLCCs with a 100 V X7R component that ...

Morse Micro’s Wi-Fi HaLow™ USB network adapters use the MM8108 Wi-Fi HaLow chipset and are available in USB-A and USB-C ...

Ambarella has rolled out a cluster of edge AI announcements centered on its new X7 accelerator, alongside expanded developer ...

Elma Electronic has released the VersaPLUS Deployment Kit, an off-the-shelf VNX+ system for integrating, qualifying and deploying embedded computing platforms based on the VITA 90 standard. Weighing ...

Lattice Semiconductor has introduced the Lattice Mach™-N2 FPGA family for system control and security in compute, communications and industrial infrastructure. Built on the Lattice Nexus™ 2 platform, ...

Micron Technology, Inc. demonstrated a 512GB DDR5 RDIMM with speeds up to 9,200 MT/s for AI, analytics, in-memory database and simulation workloads. The module uses vertically stacked DRAM dies ...

Semtech has introduced a family of 224G linear transimpedance amplifiers and drivers for near-packaged optics (NPO) and co-packaged optics (CPO) in AI/ML clusters, data centers and networking systems.