The Fraunhofer RISC-V Secure Element is now available as a licensable security platform for custom systems-on-chip (SoCs), application-specific integrated circuits (ASICs), and chiplets.

Strengthens global semiconductor supply chain resilience; monthly capacity expected to reach 44,000 12-inch wafers by 2029.

Navitas Semiconductor (Nasdaq: NVTS), the industry leader in next-generation GaNFast gallium nitride (GaN) and GeneSiC silicon carbide (SiC) power semiconductors, today announced it has been awarded ...

HANMI Semiconductor today announced that it has shipped the first “FC Bonder 75” to a customer. Designed for 2.5D AI semiconductor packaging, the new system marks the company’s expansion beyond High ...

The next generation of high-performance AI chips requires new cooling solutions. At Semicon, TRUMPF is showcasing a new ultrashort-pulse laser application that enables, for the first time, the ...

Shanghai Chengwei Semiconductor Equipment Co., Ltd. has officially announced the launch of its latest laboratory central gas supply system.

Singapore unveils SG Semiconductor, a national identity for its semiconductor sector, to raise global visibility and connect companies with its ecosystem and talent.

ACCM's Wisconsin facility will bring online laminate capacity of 20 million square feet per year in January 2027, with build-up and prepreg capacity of 87 million square feet per year online in ...

One energy-efficient architecture scales from a single die to the four-die RAIDEN-X4 flagship, combining configurable power with up to 3.36 PFLOPS of FP4 AI Compute, 256 GB of memory, 1.54 TB/s die-to ...

Synopsys has announced new innovations with TSMC that accelerate the development of next-generation AI, high-performance computing (HPC), and advanced semiconductor systems. Through AI-powered EDA ...

Expanded partnership spans TSMC A14 certification, silicon-proven IP on TSMC N3P/N2P, wafer-scale 3D-IC for hundreds of chiplets, and agentic AI flows.