Marvell Technology, Inc. today announced industry-first 2nm optical interconnect demonstrations that advance the next generation of AI data center connectivity.

Prof. Tae Geun Kim at Korea University and his co-workers have dismantled a long-standing technological barrier by learning how to sculpt heat within a nanometer-thin sandwich of materials.

Teradyne, Inc., a provider of automated test equipment and advanced robotics, today announced Iris 100, a production-ready optical test platform for microLED devices.

Magnachip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal power semiconductor platform solutions, today announced that Navitas Semiconductor Corporation has agreed to ...

Global semiconductor revenue surpassed $425bn in 2Q26 reaching another all-time high as the market grew a record 31.4% ...

Samsung Electro-Mechanics will participate in the 'KPCA Show 2026' (International Semiconductor Substrate & Advanced ...

Nordson Test & Inspection will showcase its comprehensive portfolio of industry-leading optical, X-ray, acoustic inspection, and metrology technologies powered by the Nordson Intelligence Ecosystem at ...

Multi-year strategic agreement increases capacity for high-performance SiGe technology to support growing AI infrastructure demand.

The MV-9SiP Hybrid 3D Inspection System combines 2D vision, 12-projection Digital Blue Light Moiré, and Blue Laser Scanning ...

Taiwan Semiconductor Manufacturing Company and ASML Holding N.V. announced a collaborative initiative to lead the semiconductor industry’s transition to a larger-format Extreme Ultraviolet (EUV) ...

Dnotitia Inc. (Dnotitia), an AI data infrastructure and semiconductor company, today announced that the first ASIC samples of its Vector Data Processing Unit (VDPU) have returned from fabrication, ...

Traditional measurement approaches like strain gauges and LVDT displacement sensors are reaching their limits for detecting ...