Liu Bin, a lawyer who specializes in IP disputes at Beijing Zhongwen Law Firm, welcomed the planned legislative amendments.

Sharma, Fu, and Ansari et al. developed a tool for converting plain-text instructions into photonic circuit designs with the ...

Artificial intelligence has been bottlenecked less by raw compute than by how quickly models can move data in and out of memory. A new generation of memory-centric designs is starting to change that, ...

Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

The many available options for temperature-sensing transducers. The unique challenges and benefits of using thermocouples for temperature measurement. How a new IC greatly simplifies utilizing ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Abstract: The staggering evolution of electronic products in all spheres of human life has been possible because of the advancements in the Integrated Circuit (IC) design and technologies. The ...