Big Fund Phase III has not made direct investments in semiconductor companies, deploying capital through affiliated ...
RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.
The PCB industry is making large upgrades. The largest beneficiaries of the AI boom are IC substrate makers that are part of ...
Copper surge squeezes Korea PCB profits, firms pivot toward glass substrates Korean pcb makers face margin squeeze from ...
As AI scales across enterprises and government, sovereign compute is emerging as a strategic priority for India’s data ...
The current EU Chips Act has not yet addressed the downstream capabilities needed to translate chips into finished, deployable technologies.
Abstract: Silicon carbide (SiC) power devices offer high switching speeds and power densities but are constrained by significant parasitic inductance and limited thermal dissipation capability.
With you all the way, becoming your most loyal supporter--New media integration in the PCB industry-The most valuable circuit board industry service platform by 2025! We welcome your attention and ...
TL;DR: NVIDIA plans to release the Rubin R30 AI GPU in 2028 as a China-specific successor to the B30, featuring cost-effective GDDR7 memory instead of high-end HBM4. This next-gen GPU aims to balance ...
After a long 18 months of negotiations and regulatory scrutiny, Synopsys has finalized its approximate $35 billion acquisition of Ansys. This acquisition merges two leading companies in their ...
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