Cost per token is causing EDA design budgets to balloon; what comes next isn’t entirely clear yet. Discussions have shifted ...

A scalable LPDDR-based memory platform optimized for edge AI inferencing.

Increasingly complex chip designs require more test data than those developed at older nodes and on single planar dies. The ...

Warpage is becoming a bigger constraint as package, interposer, and panel sizes grow. Negative thermal expansion (NTE) ...

Intel may be the marquee name, but materials suppliers, packaging hubs, and quantum startups will determine whether the region becomes a true semiconductor ecosystem.

Researchers from the National University of Singapore developed an atom-thin film of amorphous carbon designed to insulate ...

Package twins must track what manufacturing actually builds, not just design intent. Missing process and supplier data can ...

How advanced NoC architectures and coherent subsystem IP can address the industry's next-gen scalability, safety, and ...

First-silicon success falls; engineering capacity; minimum clock period; optimizing PyTorch; counterfeit electronics.

More capable robots require systems that realize capabilities through appropriate paradigms, compose them across time, distribute them across heterogeneous compute, and govern them under explicit ...

Most conversations about AI start and end with compute. But every training run and every inference query is ultimately a data problem, and data must live somewhere. Memory, and increasingly, the ...

Just because a chip is deemed good doesn’t mean it will work as expected.