The solution combines an SPSRAM memory compiler and standard-cell library for AIoT, wearables and always-on edge devices.
The partnership will expand local access to EOS polymer and metal LPBF systems for R&D, prototyping and production.
The upgraded system offers up to 7.6 million points/s and 62 laser lines for faster data acquisition.
The company will support five skills competitions at WorldSkills Shanghai 2026 with 3D scanning and metrology technologies.
New A14 flows, agentic AI tools, multi-die design capabilities and silicon-proven IP support advanced semiconductor development.
The agent converts specifications into RTL and analyzes design updates for power, performance and area targets.
The new printer supports 13 × 19-inch media, while a cotton primer expands sublimation applications beyond polyester fabrics.
The facility will support device evaluation, engineering development, pilot production, and training at GSME’s Silicon Valley ...
The switches support up to 1×32 configurations and provide remote management through HTTPS, SSH CLI and REST APIs.
The collaboration will examine AI workloads spanning perception, interaction, computing platforms and in-vehicle applications.
The PCBA supports Android and Linux and offers up to 10.3 TOPS NPU performance with optional 5G RedCap and Wi-Fi 6E.
FCT supports custom sensing patterns, connector interfaces and detection zones for servers, cold plates, manifolds and CDUs.
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