As the AI boom fuels capacity expansion across logic and memory, silicon wafers are emerging as another key beneficiary, with ...

China’s two major memory chipmakers are accelerating capacity expansion. According to Commercial Times, CXMT’s monthly DRAM ...

Glass substrate adoption by major tech players may be closer than expected. KIPOST reports that NVIDIA has asked substrate ...

As interest from external customers in Intel’s EMIB (Embedded Multi-die Interconnect Bridge) continues to grow, substrate ...

As TSMC prepares for A16 risk production in late 2026, its next-generation A14 node is reportedly running ahead of schedule.

Rare earths are set to be a key focus of the upcoming meeting between U.S. President Donald Trump and Chinese President Xi ...

Fresh off announcing LPDDR6 mass production and its debut in Xiaomi’s 18 Fold, CXMT has reached another major milestone.

The rise of personal AI agents could change the computing requirements behind AI workloads. According to Wccftech, personal ...

China’s semiconductor sector delivered record first-half results in 2026, fueled by a memory upcycle, growing AI computing ...

Huawei has unveiled an accelerated roadmap for its next-generation AI chips at Huawei Connect 2026 in Shanghai. Citing ...

As Qualcomm’s Snapdragon Summit kicks off on September 22, Samsung is marking a mobile memory milestone of its own. The company says it has become ...

Intel has recently disclosed a patent originally filed in 2022, revealing an IC packaging architecture that integrates Micro ...